印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)制(zhi)造技術起步于(yu)(yu)20世(shi)紀(ji)(ji)40年(nian)代中(zhong)(zhong)期(qi)。20世(shi)紀(ji)(ji)40年(nian)代中(zhong)(zhong)期(qi)至50年(nian)代，電(dian)(dian)子(zi)工業處于(yu)(yu)電(dian)(dian)子(zi)管(guan)時代，所用(yong)(yong)的(de)(de)印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)大多(duo)為單面(mian)(mian)(mian)板(ban)(ban)，主要(yao)用(yong)(yong)在收(shou)音機和(he)電(dian)(dian)視機等民用(yong)(yong)電(dian)(dian)子(zi)產(chan)品中(zhong)(zhong)。20世(shi)紀(ji)(ji)60年(nian)代初期(qi)，由(you)(you)于(yu)(yu)晶體(ti)管(guan)的(de)(de)廣泛使(shi)(shi)用(yong)(yong)，電(dian)(dian)子(zi)元(yuan)器(qi)(qi)件的(de)(de)體(ti)積減小(xiao)，安(an)裝(zhuang)(zhuang)密(mi)度大為增加(jia)(jia)，印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)由(you)(you)單面(mian)(mian)(mian)板(ban)(ban)發展(zhan)(zhan)到(dao)雙(shuang)面(mian)(mian)(mian)板(ban)(ban)，應用(yong)(yong)范(fan)圍(wei)也(ye)擴展(zhan)(zhan)到(dao)工業和(he)軍(jun)事領域。20世(shi)紀(ji)(ji)60年(nian)代出現(xian)集(ji)成(cheng)電(dian)(dian)路(lu)(lu)，使(shi)(shi)雙(shuang)面(mian)(mian)(mian)金(jin)屬化孔(kong)(kong)印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)得(de)以(yi)普及并出現(xian)了(le)多(duo)層印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)和(he)能夠扭曲伸(shen)縮的(de)(de)撓性(xing)印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)。20世(shi)紀(ji)(ji)70年(nian)代后，由(you)(you)于(yu)(yu)大規模和(he)超大規模集(ji)成(cheng)電(dian)(dian)路(lu)(lu)的(de)(de)發展(zhan)(zhan)，電(dian)(dian)子(zi)設備(bei)越來越小(xiao)型化和(he)微(wei)型化，表(biao)面(mian)(mian)(mian)安(an)裝(zhuang)(zhuang)技術迅速發展(zhan)(zhan)。表(biao)面(mian)(mian)(mian)安(an)裝(zhuang)(zhuang)器(qi)(qi)件的(de)(de)管(guan)腳(jiao)采用(yong)(yong)無引線或(huo)水平方向封裝(zhuang)(zhuang)的(de)(de)形式，可(ke)以(yi)平貼在印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)的(de)(de)表(biao)面(mian)(mian)(mian)，管(guan)腳(jiao)與印制(zhi)電(dian)(dian)路(lu)(lu)板(ban)(ban)的(de)(de)焊接不需要(yao)打孔(kong)(kong)，這樣(yang)，提(ti)高了(le)元(yuan)器(qi)(qi)件的(de)(de)安(an)裝(zhuang)(zhuang)密(mi)度，增加(jia)(jia)了(le)系(xi)統的(de)(de)可(ke)靠性(xing)，并有利于(yu)(yu)生產(chan)的(de)(de)自動化。

印制電路板的(de)(de)加工水平也在不(bu)斷(duan)地提(ti)高(gao)。目前，衡量(liang)加工水平的(de)(de)標準有允(yun)許的(de)(de)導線小(xiao)(xiao)寬度、線間小(xiao)(xiao)距離、孔的(de)(de)定位精度、PCB的(de)(de)層數等。