生(sheng)產多(duo)層PCB過(guo)孔設計(ji)(ji)和(he)線(xian)路布線(xian)設計(ji)(ji)是線(xian)路板重(zhong)要的(de)(de)設計(ji)(ji)PCB多(duo)層板主要用(yong)于通(tong)(tong)信、醫療等領域(yu)。為(wei)了滿(man)足各行業對(dui)精密多(duo)層電(dian)路板的(de)(de)需求，過(guo)孔設計(ji)(ji)是一個(ge)重(zhong)要環節。過(guo)孔通(tong)(tong)常分為(wei)盲孔、埋孔和(he)通(tong)(tong)孔三類PCB通(tong)(tong)過(guo)對(dui)孔的(de)(de)寄生(sheng)電(dian)容和(he)寄生(sheng)電(dian)感分析(xi)，總結(jie)出關于PCB多(duo)層板生(sheng)產加工設計(ji)(ji)過(guo)孔的(de)(de)具(ju)體(ti)注意事項是什么！

 ①過(guo)孔(kong)寄生(sheng)電容(rong)：PCB過(guo)孔(kong)本身就有一個寄生(sheng)電容(rong)器，當地板上的(de)隔離孔(kong)直(zhi)徑為(wei)D二、過(guo)孔(kong)焊盤(pan)直(zhi)徑為(wei)D1時(shi)(shi)，PCB板厚離為(wei)T，PCB介電常數為(wei)基材ε，過(guo)孔(kong)寄生(sheng)電容(rong)器的(de)大小與C=1.41εTD1/(D2-D1)，過(guo)孔(kong)寄生(sheng)電容(rong)對電路的(de)主要影(ying)響(xiang)是(shi)延長信號的(de)上升時(shi)(shi)間，降低電路的(de)運行速度。電容(rong)值越(yue)(yue)小，影(ying)響(xiang)越(yue)(yue)小，電容(rong)值越(yue)(yue)大

 ②過(guo)(guo)孔(kong)(kong)(kong)寄生電(dian)感(gan)：除(chu)寄生電(dian)容(rong)外，還有寄生電(dian)感(gan)。在多(duo)層電(dian)路板的高(gao)速運行中，過(guo)(guo)孔(kong)(kong)(kong)寄生電(dian)感(gan)的危害遠大于寄生電(dian)容(rong)的影(ying)(ying)響。L指孔(kong)(kong)(kong)電(dian)感(gan)，H指孔(kong)(kong)(kong)長，D指中心鉆(zhan)孔(kong)(kong)(kong)直(zhi)徑，過(guo)(guo)孔(kong)(kong)(kong)寄生電(dian)感(gan)近(jin)似(si)L=5.08h[ln(4h/d) 1]單(dan)從數式(shi)來(lai)看，過(guo)(guo)孔(kong)(kong)(kong)直(zhi)徑對電(dian)感(gan)影(ying)(ying)響較小，對電(dian)感(gan)影(ying)(ying)響過(guo)(guo)孔(kong)(kong)(kong)長度。