生(sheng)產多(duo)層PCB過(guo)孔(kong)設計(ji)和線(xian)(xian)路布線(xian)(xian)設計(ji)是線(xian)(xian)路板(ban)重(zhong)要(yao)(yao)的(de)(de)設計(ji)PCB多(duo)層板(ban)主要(yao)(yao)用于通(tong)信、醫療等領域。為(wei)了(le)滿(man)足各行(xing)業對(dui)精密多(duo)層電路板(ban)的(de)(de)需求，過(guo)孔(kong)設計(ji)是一個重(zhong)要(yao)(yao)環節(jie)。過(guo)孔(kong)通(tong)常分為(wei)盲(mang)孔(kong)、埋孔(kong)和通(tong)孔(kong)三類PCB通(tong)過(guo)對(dui)孔(kong)的(de)(de)寄生(sheng)電容(rong)和寄生(sheng)電感分析，總(zong)結出關于PCB多(duo)層板(ban)生(sheng)產加工設計(ji)過(guo)孔(kong)的(de)(de)具(ju)體注意事項是什么！

 ①過(guo)孔(kong)(kong)寄生(sheng)電(dian)容(rong)：PCB過(guo)孔(kong)(kong)本身就有一個(ge)寄生(sheng)電(dian)容(rong)器(qi)，當地板上的(de)隔離(li)孔(kong)(kong)直徑為(wei)(wei)D二、過(guo)孔(kong)(kong)焊盤(pan)直徑為(wei)(wei)D1時，PCB板厚(hou)離(li)為(wei)(wei)T，PCB介電(dian)常數為(wei)(wei)基材ε，過(guo)孔(kong)(kong)寄生(sheng)電(dian)容(rong)器(qi)的(de)大小(xiao)與(yu)C=1.41εTD1/(D2-D1)，過(guo)孔(kong)(kong)寄生(sheng)電(dian)容(rong)對電(dian)路的(de)主要影響是延長信號的(de)上升時間(jian)，降低電(dian)路的(de)運行速度(du)。電(dian)容(rong)值(zhi)越小(xiao)，影響越小(xiao)，電(dian)容(rong)值(zhi)越大

 ②過(guo)孔(kong)寄(ji)生(sheng)電(dian)(dian)感：除寄(ji)生(sheng)電(dian)(dian)容(rong)外(wai)，還有寄(ji)生(sheng)電(dian)(dian)感。在多層電(dian)(dian)路板的(de)高速運行中，過(guo)孔(kong)寄(ji)生(sheng)電(dian)(dian)感的(de)危害遠(yuan)大(da)于寄(ji)生(sheng)電(dian)(dian)容(rong)的(de)影響(xiang)。L指(zhi)孔(kong)電(dian)(dian)感，H指(zhi)孔(kong)長(chang)，D指(zhi)中心(xin)鉆孔(kong)直徑，過(guo)孔(kong)寄(ji)生(sheng)電(dian)(dian)感近似L=5.08h[ln(4h/d) 1]單從數式來看，過(guo)孔(kong)直徑對電(dian)(dian)感影響(xiang)較小，對電(dian)(dian)感影響(xiang)過(guo)孔(kong)長(chang)度。