FPC的結構(gou)，簡單來說，就是(shi)用(yong)銅箔蝕刻出(chu)需要的線路，然后(hou)把不(bu)需要焊接(jie)(jie)或(huo)(huo)接(jie)(jie)觸的區(qu)(qu)域用(yong)覆(fu)蓋(gai)膜遮蓋(gai)，使之絕緣，只(zhi)(zhi)留下焊盤區(qu)(qu)或(huo)(huo)手(shou)指(zhi)區(qu)(qu)。因此，銅箔與覆(fu)蓋(gai)膜就是(shi)FPC的基本材料，其(qi)他涉及的，只(zhi)(zhi)是(shi)工藝處理與輔材。

FPC使(shi)用(yong)(yong)的(de)銅(tong)(tong)箔(bo)(bo)(bo)。按材質分，主(zhu)要(yao)使(shi)用(yong)(yong)壓(ya)(ya)(ya)延(yan)(yan)銅(tong)(tong)箔(bo)(bo)(bo)與(yu)電(dian)(dian)解銅(tong)(tong)箔(bo)(bo)(bo)。壓(ya)(ya)(ya)延(yan)(yan)銅(tong)(tong)箔(bo)(bo)(bo)韌性(xing)較(jiao)(jiao)好，不易斷裂，但(dan)質地(di)較(jiao)(jiao)軟，彎折后(hou)易留下折痕;電(dian)(dian)解銅(tong)(tong)箔(bo)(bo)(bo)質地(di)較(jiao)(jiao)脆，比壓(ya)(ya)(ya)延(yan)(yan)銅(tong)(tong)箔(bo)(bo)(bo)易斷裂，但(dan)質地(di)較(jiao)(jiao)硬，恢復性(xing)能(neng)較(jiao)(jiao)好，較(jiao)(jiao)厚，適合彎折次數少，但(dan)耐高電(dian)(dian)流電(dian)(dian)壓(ya)(ya)(ya)。按層次分，無(wu)論是壓(ya)(ya)(ya)延(yan)(yan)還是電(dian)(dian)解，都有雙(shuang)面基(ji)材與(yu)單面基(ji)材。銅(tong)(tong)箔(bo)(bo)(bo)的(de)選用(yong)(yong)，要(yao)根據FPC具(ju)體的(de)使(shi)用(yong)(yong)環境(jing)進行選擇，如排線(xian)、按鍵板、電(dian)(dian)容屏板等適合用(yong)(yong)壓(ya)(ya)(ya)延(yan)(yan)銅(tong)(tong)箔(bo)(bo)(bo)，電(dian)(dian)源板等，適合用(yong)(yong)電(dian)(dian)解銅(tong)(tong)箔(bo)(bo)(bo)。銅(tong)(tong)箔(bo)(bo)(bo)的(de)厚度，在FPC生產制作中，常用(yong)(yong)的(de)有1/3oz,1/2oz,1oz。

FPC覆蓋膜的(de)，一般是(shi)(shi)聚酰(xian)亞胺樹脂(zhi)，即(ji)常說的(de)PI。PI的(de)厚度也有不同，有12.5um,27.5um。PI的(de)顏色(se)，***常用的(de)是(shi)(shi)棕黃色(se)，其(qi)次就是(shi)(shi)黑色(se)與白色(se)。其(qi)他顏色(se)很少見。