多(duo)層(ceng)(ceng)(ceng)電(dian)(dian)(dian)路板(ban)(ban)(ban)顧名思議就(jiu)是兩層(ceng)(ceng)(ceng)以(yi)上的(de)(de)(de)(de)電(dian)(dian)(dian)路板(ban)(ban)(ban)才能稱作多(duo)層(ceng)(ceng)(ceng)，之前給大家分(fen)析(xi)過(guo)什(shen)么是雙面電(dian)(dian)(dian)路板(ban)(ban)(ban)，那么多(duo)層(ceng)(ceng)(ceng)板(ban)(ban)(ban)也就(jiu)是超(chao)過(guo)兩層(ceng)(ceng)(ceng)，比(bi)如說四層(ceng)(ceng)(ceng)，六層(ceng)(ceng)(ceng)，八層(ceng)(ceng)(ceng)等等。當然有些設(she)計是三層(ceng)(ceng)(ceng)或(huo)五層(ceng)(ceng)(ceng)線(xian)(xian)路的(de)(de)(de)(de)，也叫(jiao)多(duo)層(ceng)(ceng)(ceng)PCB電(dian)(dian)(dian)路板(ban)(ban)(ban)。大于二層(ceng)(ceng)(ceng)板(ban)(ban)(ban)的(de)(de)(de)(de)導電(dian)(dian)(dian)走線(xian)(xian)圖，層(ceng)(ceng)(ceng)與層(ceng)(ceng)(ceng)之間(jian)有絕緣基(ji)材隔開，每(mei)一層(ceng)(ceng)(ceng)線(xian)(xian)路印制(zhi)好后，再(zai)通(tong)過(guo)壓合，把(ba)每(mei)層(ceng)(ceng)(ceng)線(xian)(xian)路重(zhong)疊在一起。之后再(zai)鉆孔，由過(guo)孔來實現每(mei)層(ceng)(ceng)(ceng)線(xian)(xian)路之間(jian)的(de)(de)(de)(de)導通(tong)。多(duo)層(ceng)(ceng)(ceng)PCB電(dian)(dian)(dian)路板(ban)(ban)(ban)的(de)(de)(de)(de)優點是線(xian)(xian)路可以(yi)分(fen)布(bu)在多(duo)層(ceng)(ceng)(ceng)里(li)面布(bu)線(xian)(xian)，從而可以(yi)設(she)計較為精密的(de)(de)(de)(de)產品。或(huo)者體(ti)積較小(xiao)的(de)(de)(de)(de)產品都可以(yi)通(tong)過(guo)多(duo)層(ceng)(ceng)(ceng)板(ban)(ban)(ban)來實現。如：手機(ji)電(dian)(dian)(dian)路板(ban)(ban)(ban)、微型投影儀、錄音筆等體(ti)積較的(de)(de)(de)(de)產品。另外多(duo)層(ceng)(ceng)(ceng)可以(yi)加大設(she)計的(de)(de)(de)(de)靈活性，可以(yi)的(de)(de)(de)(de)控(kong)制(zhi)差分(fen)阻(zu)抗(kang)(kang)以(yi)及單(dan)端阻(zu)抗(kang)(kang)，以(yi)及一些信號頻率的(de)(de)(de)(de)輸(shu)出等。

　　多(duo)層(ceng)(ceng)電路(lu)板(ban)(ban)是電子技術向高速度(du)、多(duo)功能、大(da)容量、小(xiao)體積方向發展(zhan)的(de)(de)(de)(de)必然(ran)產物。隨著電子技術的(de)(de)(de)(de)不斷發展(zhan)，尤其是大(da)規模和(he)(he)超(chao)大(da)規模集成電路(lu)的(de)(de)(de)(de)廣泛深入應(ying)用，多(duo)層(ceng)(ceng)印(yin)制(zhi)(zhi)電路(lu)正迅速向高密(mi)(mi)度(du)、高精(jing)度(du)、高層(ceng)(ceng)數化(hua)方向發展(zhan)提(ti)(ti)出現(xian)了微細線條、小(xiao)孔(kong)徑貫穿、盲孔(kong)埋孔(kong)高板(ban)(ban)厚(hou)孔(kong)徑比等(deng)技術以滿足市場的(de)(de)(de)(de)需要(yao)。由(you)于(yu)計算機和(he)(he)航(hang)空(kong)航(hang)天工業(ye)對高速電路(lu)的(de)(de)(de)(de)需要(yao).要(yao)求進一步提(ti)(ti)高封裝密(mi)(mi)度(du)，加上分離元件(jian)尺寸的(de)(de)(de)(de)縮小(xiao)和(he)(he)微電子學的(de)(de)(de)(de)迅速發展(zhan)，電子設備(bei)正向體積縮小(xiao)，質量減(jian)輕的(de)(de)(de)(de)方向發展(zhan);單(dan)、雙面(mian)印(yin)制(zhi)(zhi)板(ban)(ban)由(you)于(yu)可用空(kong)間的(de)(de)(de)(de)限制(zhi)(zhi)，已不可能實現(xian)裝配密(mi)(mi)度(du)的(de)(de)(de)(de)更(geng)進一步的(de)(de)(de)(de)提(ti)(ti)高。因此，就有必要(yao)考慮使用比雙面(mian)板(ban)(ban)層(ceng)(ceng)數更(geng)多(duo)的(de)(de)(de)(de)印(yin)制(zhi)(zhi)電路(lu)。這就給多(duo)層(ceng)(ceng)電路(lu)板(ban)(ban)的(de)(de)(de)(de)出現(xian)創造了條件(jian)。