pcb廠家講解pcb電路板的制造工藝
2017-06-29 來自: 深圳市富業達電子有限公司 瀏覽次(ci)數:263
pcb廠家講解(jie)pcb電路板(ban)的制造工藝
(1)手工(gong)制(zhi)造印(yin)制(zhi)電路板的工(gong)藝
手工制(zhi)造PCB的(de)(de)(de)一道(dao)基本工序是將設計好的(de)(de)(de)PCB圖轉印到(dao)覆銅(tong)板上。***的(de)(de)(de)有(you)效的(de)(de)(de)方法——蝕刻法,利用防護性(xing)的(de)(de)(de)抗蝕材料在覆銅(tong)板上形(xing)成圖形(xing),不需要(yao)的(de)(de)(de)銅(tong)箔隨化學腐蝕而(er)被去掉(diao)。腐蝕結束后,將抗蝕層清洗掉(diao),從而(er)就(jiu)能看到(dao)應有(you)圖形(xing)。
(2)工廠(chang)制(zhi)作印制(zhi)電(dian)路板的生產(chan)工藝
工廠(chang)生(sheng)(sheng)(sheng)產(chan)印(yin)制(zhi)(zhi)電(dian)路(lu)板需要經(jing)過繁雜的(de)(de)工序。在生(sheng)(sheng)(sheng)產(chan)過程(cheng)中(zhong),每(mei)項(xiang)技術都有(you)明確的(de)(de)操作方(fang)法,除(chu)制(zhi)(zhi)作底(di)片(pian)(pian)(pian)外,孔金屬化(hua)及圖(tu)形電(dian)鍍蝕(shi)刻是(shi)生(sheng)(sheng)(sheng)產(chan)的(de)(de)關鍵。印(yin)制(zhi)(zhi)電(dian)路(lu)原(yuan)(yuan)版(ban)底(di)圖(tu)的(de)(de)制(zhi)(zhi)作方(fang)法:對印(yin)制(zhi)(zhi)電(dian)路(lu)板來說(shuo),用什么方(fang)法都***滿(man)足質(zhi)(zhi)量要求的(de)(de)1:1原(yuan)(yuan)版(ban)底(di)片(pian)(pian)(pian),同時(shi)還(huan)要將原(yuan)(yuan)版(ban)底(di)片(pian)(pian)(pian)翻新(xin)為(wei)生(sheng)(sheng)(sheng)產(chan)底(di)片(pian)(pian)(pian),原(yuan)(yuan)版(ban)底(di)片(pian)(pian)(pian)的(de)(de)來源有(you)兩種(zhong)(zhong),一(yi)種(zhong)(zhong)是(shi)制(zhi)(zhi)作照相底(di)圖(tu),拍照后得到原(yuan)(yuan)版(ban)底(di)片(pian)(pian)(pian),一(yi)種(zhong)(zhong)是(shi)利(li)用計算機輔助系(xi)統和光(guang)繪機直(zhi)接繪出原(yuan)(yuan)版(ban)底(di)片(pian)(pian)(pian),PCB的(de)(de)印(yin)制(zhi)(zhi)及蝕(shi)刻及工藝:制(zhi)(zhi)抗蝕(shi)或電(dian)鍍的(de)(de)掩模圖(tu)形有(you)兩種(zhong)(zhong)通用方(fang)法:絲網漏印(yin)法和感光(guang)干膜(mo)法。絲網漏印(yin)法一(yi)般用于批量較大、單精度低的(de)(de)單面或雙面PCB生(sheng)(sheng)(sheng)產(chan),便(bian)于自動化(hua)。而(er)感光(guang)干膜(mo)法主要是(shi)提(ti)高生(sheng)(sheng)(sheng)產(chan)效(xiao)率、簡(jian)化(hua)工藝、提(ti)高制(zhi)(zhi)板質(zhi)(zhi)量等方(fang)面。